DB298 Straight Insert Bracket wafer ring Machine—Advanced Optoelectronic Equipment(Shenzhen)Co.LTD

DB298 Straight Insert Bracket wafer ring Machine

Equipment Overview

DB85 semiconductor high-speed placement machine for automatic placement of flat semiconductor frames, ICs, flat LEDs and other products:

Automatic loading and unloading system reduces refueling time

Quality inspection function after solid wafer ring

Chip sorting function (MAP)

Chip reverse detection function before mounting

Automatic chip expansion function

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Basic performance

Operating system: WINDOWS XP
Operation interface: Chinese/English interface
Work cycle time: 200MSEC (fastest) UPH=18K
Positioning accuracy: ± 1.5MIL
Angle accuracy: ± 3 °
Chip size: 0.1MM ×0.1MM ~ 4MM ×4MM
Support bracket: flat semiconductor frame, IC, flat LED and other brackets
Power supply: 220V±10V, 50Hz, 800W
Chip stroke: 6” ~ 10” (selected according to wafer diameter)
Thimble system: single thimble system or multiple thimble system
Maximum bracket size: 80 MM × 200MM
Double glue dispensing system: XY adjustable glue dispensing, constant temperature rubber cylinder control
Automatic loading and unloading system: stacking clip loading and separate material box receiving
Working box width: 40MM～80MM adjustable

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国内首家固晶机

自主产权企业

Brightlux

Create high-precision packaging equipment

Breakthrough industry standards, accuracy up to ±5 microns

DB298 Straight Insert Bracket wafer ring Machine

Operating system: WINDOWS XP

Operation interface: Chinese/English interface

Work cycle time: 200MSEC (fastest) UPH=18K

Positioning accuracy: ± 1.5MIL

Angle accuracy: ± 3 °

Chip size: 0.1MM ×0.1MM ~ 4MM ×4MM

Support bracket: flat semiconductor frame, IC, flat LED and other brackets

Power supply: 220V±10V, 50Hz, 800W

Chip stroke: 6” ~ 10” (selected according to wafer diameter)

Thimble system: single thimble system or multiple thimble system

Maximum bracket size: 80 MM × 200MM

Double glue dispensing system: XY adjustable glue dispensing, constant temperature rubber cylinder control

Automatic loading and unloading system: stacking clip loading and separate material box receiving

Working box width: 40MM～80MM adjustable

Contact Information

Contact Information

国内首家固晶机

自主产权企业

Into Brightlux

Advanced Optoelectronics-a well-known domestic supplier of semiconductor and LED packaging equipment

Product and solutions

Advanced Optoelectronics-a well-known domestic supplier of semiconductor and LED packaging equipment

R & D system

Advanced Optoelectronics-a well-known domestic supplier of semiconductor and LED packaging equipment

News

Advanced Optoelectronics-a well-known domestic supplier of semiconductor and LED packaging equipment

Contact us

Advanced Optoelectronics-a well-known domestic supplier of semiconductor and LED packaging equipment

Brightlux

Create high-precision packaging equipment

Breakthrough industry standards, accuracy up to ±5 microns

DB298 Straight Insert Bracket wafer ring Machine

Operating system: WINDOWS XP

Operation interface: Chinese/English interface

Work cycle time: 200MSEC (fastest) UPH=18K

Positioning accuracy: ± 1.5MIL

Angle accuracy: ± 3 °

Chip size: 0.1MM ×0.1MM ~ 4MM ×4MM

Support bracket: flat semiconductor frame, IC, flat LED and other brackets

Power supply: 220V±10V, 50Hz, 800W

Chip stroke: 6” ~ 10” (selected according to wafer diameter)

Thimble system: single thimble system or multiple thimble system

Maximum bracket size: 80 MM × 200MM

Double glue dispensing system: XY adjustable glue dispensing, constant temperature rubber cylinder control

Automatic loading and unloading system: stacking clip loading and separate material box receiving

Working box width: 40MM～80MM adjustable

Contact Information

Contact Information