DB603

Equipment Overview

DB603 mini LED high-speed die-bonding machine is aimed at the automatic die-bonding of small/medium-size backlight and full-color mini LED products. It can realize stand-alone or online operation.

立即咨询

Basic performance

Operating system: Windows 7
Operation interface: Chinese/English interface
Working cycle time: 90ms (UPH=40K/H, 4*8mil)
Positioning accuracy: ±20um @CPK >1.33
Angle accuracy: ± 3 °
Wafer size: 3mil*3.5mil~20mil*20mil
Power supply: 220V±10V, 50Hz, 800W
Three wafer ring size: 6 inch (can hold three RGB chips)
Product length: ≤170~320mm
Product width: ≤80~ 200mm
Online Agreement: Custom

Back to list

Share it:

Next:DB601

Contact Information

WeChat public account

Address:No.144-3, Hengping Road, Yuanshan Street, Longgang District, Shenzhen

Fax:+86-755-89705057

Tel:+86-755-28651309

国内首家固晶机

自主产权企业

Brightlux

Create high-precision packaging equipment

Breakthrough industry standards, accuracy up to ±5 microns

DB603

Operating system: Windows 7

Operation interface: Chinese/English interface

Working cycle time: 90ms (UPH=40K/H, 4*8mil)

Positioning accuracy: ±20um @CPK >1.33

Angle accuracy: ± 3 °

Wafer size: 3mil3.5mil~20mil20mil

Power supply: 220V±10V, 50Hz, 800W

Three wafer ring size: 6 inch (can hold three RGB chips)

Product length: ≤170~320mm

Product width: ≤80~ 200mm

Online Agreement: Custom

Contact Information

Contact Information

国内首家固晶机

自主产权企业

Into Brightlux

Advanced Optoelectronics-a well-known domestic supplier of semiconductor and LED packaging equipment

Product and solutions

Advanced Optoelectronics-a well-known domestic supplier of semiconductor and LED packaging equipment

R & D system

Advanced Optoelectronics-a well-known domestic supplier of semiconductor and LED packaging equipment

News

Advanced Optoelectronics-a well-known domestic supplier of semiconductor and LED packaging equipment

Contact us

Advanced Optoelectronics-a well-known domestic supplier of semiconductor and LED packaging equipment

Brightlux

Create high-precision packaging equipment

Breakthrough industry standards, accuracy up to ±5 microns

DB603

Operating system: Windows 7

Operation interface: Chinese/English interface

Working cycle time: 90ms (UPH=40K/H, 4*8mil)

Positioning accuracy: ±20um @CPK >1.33

Angle accuracy: ± 3 °

Wafer size: 3mil*3.5mil~20mil*20mil

Power supply: 220V±10V, 50Hz, 800W

Three wafer ring size: 6 inch (can hold three RGB chips)

Product length: ≤170~320mm

Product width: ≤80~ 200mm

Online Agreement: Custom

Contact Information

Contact Information

Wafer size: 3mil3.5mil~20mil20mil