国内首家固晶机

自主产权企业

CN EN

Brightlux

Create high-precision packaging equipment

Breakthrough industry standards, accuracy up to ±5 microns
Camera module

DB85

Equipment Overview

DB85 semiconductor high-speed placement machine for automatic placement of flat semiconductor frames, ICs, flat LEDs and other products:

Automatic loading and unloading system reduces refueling time

Uninterrupted feeding and discharging improves efficiency

Adjustable width of upper and lower material table and worktable

One person controls multiple machines to reduce labor cost

Quality inspection function after solid crystal

Chip sorting function

Chip reverse detection function before mounting

Automatic chip expansion function

Independent double glue system

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Basic performance
  • Operating system: WINDOWS XP

  • Operation interface: Chinese/English interface

  • Work cycle time: 200MSEC (fastest) UPH=18K

  • Positioning accuracy: ± 1.5MIL

  • Angle accuracy: ± 3 °

  • Chip size: 0.1MM ×0.1MM ~ 4MM ×4MM

  • Support bracket: flat semiconductor frame, IC, flat LED and other brackets

  • Vision system: precise and adjustable chip image recognition and positioning system

  • Power supply: 220V±10V, 50Hz, 800W

  • Air source (pressure): 5 ~ 6Kgf / cm2

  • Chip stroke: 6” ~ 10” (selected according to wafer diameter)

  • Thimble system: single thimble system or multiple thimble system

  • Maximum bracket size: 80 MM × 200MM

  • Double glue dispensing system: XY adjustable glue dispensing, constant temperature rubber cylinder control

  • Automatic loading and unloading system: stacking clip loading and separate material box receiving

  • Working box width: 40MM~80MM adjustable

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