国内首家固晶机

自主产权企业

CN EN

Brightlux

Create high-precision packaging equipment

Breakthrough industry standards, accuracy up to ±5 microns
Illumination

DB886D

Equipment Overview

DB886D double-head high-speed automatic die-bonding machine, automatic die-bonding for flat LED and COB products

Double welding head solid wafer ring super high production capacity

Adjustable width of upper and lower material table and worktable

Quality inspection function after solid wafer ring

Chip sorting function

Automatic chip correction function

7” and 6” wafer ring shared functions

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Basic performance
  • Operating system: Windows 7

  • Operation interface: Chinese interface

  • Working cycle time: 60msec(Max)UPH=60K

  • Positioning accuracy: ± 1mil

  • Angle accuracy: ± 3 °

  • Wafer size: 3.5mil × 3.5 mil ~ 100 mil × 100 mil

  • Maximum bracket size: 75mm × 160mm

  • Power supply: 220V±10V, 50Hz, 800W

  • Double dispensing system: XY adjustable dispensing, constant temperature dispensing arm

  • Working box width: 30mm~75mm adjustable

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