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Brightlux

Create high-precision packaging equipment

Breakthrough industry standards, accuracy up to ±5 microns
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DB888

Equipment Overview

DB888 automatic wafer ring bonding machine, three-connected machine has three welding heads and nine wafer rings, and each welding head can be operated independently, each single machine has three wafer rings (can hold three RGB chips at the same time), has excellent production performance, this This machine can be widely used in the production of RGB poly wafer ring line and solder paste materials, which can greatly improve the production yield and production efficiency, and meet the mass production of Mini LED.

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Basic performance
  • Operating system: Windows 7

  • Work cycle time: single head 140msuph: 24K three-piece conjoined 70 ms

  • XY positioning accuracy: ±1mil

  • Wafer deflection angle: ± 3 °

  • Use chip size: 4mil*4mil~100mil*100mil

  • Bracket: flat LED light, SMD (0603, 1010), TOP SMD (3014, 2835), Chip, RGB, etc.

  • Quality inspection function after solid wafer ring: glue quantity detection, wafer distance deviation detection, solid wafer ring angle error detection

  • Production material specification range: width 50-90mm adjustable \ length 100-270 mm

  • Dispensing system: precise and simple XY direction fine adjustment, constant temperature dispensing arm

  • Automatic loading and unloading system: separate material box loading and unloading

  • Wafer ring size: ø6″

  • Maximum bracket size: 80 MM × 200MM

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