DB6060—Advanced Optoelectronic Equipment(Shenzhen)Co.LTD

DB6060

Equipment Overview

DB6060 series double-head multi-function high-speed automatic wafer ring bonding machine, for flat LED, COB product automatic wafer ring bonding

Quality inspection function after solid wafer ring

Chip sorting function

Wafer automatic wafer ring change function (optional)

Multi-angle die bonding function of the wafer: the wafer ring rotates within ±180°, which can control the wafer to be fixed at 0°, 90°, 180°, and 270°, realizing the position of the die bonding at different angles on the product frame

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Basic performance

Operating system: Windows 7
Operation interface: Chinese interface
Work cycle time: 50msec (fastest) UPH=72K
Positioning accuracy: ± 1mil
Angle accuracy: ± 3 °
Wafer size: 3.5mil × 3.5 mil ~ 100 mil × 100 mil
Power supply: 220V±10V, 50Hz, 800W
Wafer ring size: 6"
Maximum bracket size: 75mm × 160mm
Double dispensing system: XY adjustable dispensing, constant temperature dispensing arm
Free combination of two loading and unloading methods:
Stacking feeding: material grabbing or vacuum suction
Separate material box loading and unloading
Working box width: 40mm～75mm adjustable

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国内首家固晶机

自主产权企业

Brightlux

Create high-precision packaging equipment

Breakthrough industry standards, accuracy up to ±5 microns

DB6060

Operating system: Windows 7

Operation interface: Chinese interface

Work cycle time: 50msec (fastest) UPH=72K

Positioning accuracy: ± 1mil

Angle accuracy: ± 3 °

Wafer size: 3.5mil × 3.5 mil ~ 100 mil × 100 mil

Power supply: 220V±10V, 50Hz, 800W

Wafer ring size: 6"

Maximum bracket size: 75mm × 160mm

Double dispensing system: XY adjustable dispensing, constant temperature dispensing arm

Free combination of two loading and unloading methods:
Stacking feeding: material grabbing or vacuum suction
Separate material box loading and unloading

Working box width: 40mm～75mm adjustable

Contact Information

Contact Information

国内首家固晶机

自主产权企业

Into Brightlux

Advanced Optoelectronics-a well-known domestic supplier of semiconductor and LED packaging equipment

Product and solutions

Advanced Optoelectronics-a well-known domestic supplier of semiconductor and LED packaging equipment

R & D system

Advanced Optoelectronics-a well-known domestic supplier of semiconductor and LED packaging equipment

News

Advanced Optoelectronics-a well-known domestic supplier of semiconductor and LED packaging equipment

Contact us

Advanced Optoelectronics-a well-known domestic supplier of semiconductor and LED packaging equipment

Brightlux

Create high-precision packaging equipment

Breakthrough industry standards, accuracy up to ±5 microns

DB6060

Operating system: Windows 7

Operation interface: Chinese interface

Work cycle time: 50msec (fastest) UPH=72K

Positioning accuracy: ± 1mil

Angle accuracy: ± 3 °

Wafer size: 3.5mil × 3.5 mil ~ 100 mil × 100 mil

Power supply: 220V±10V, 50Hz, 800W

Wafer ring size: 6"

Maximum bracket size: 75mm × 160mm

Double dispensing system: XY adjustable dispensing, constant temperature dispensing arm

Free combination of two loading and unloading methods:Stacking feeding: material grabbing or vacuum suctionSeparate material box loading and unloading

Working box width: 40mm～75mm adjustable

Contact Information

Contact Information

Free combination of two loading and unloading methods:
Stacking feeding: material grabbing or vacuum suction
Separate material box loading and unloading