With the world's leading invention patent technology and the hard work of all employees, the company has achieved faster and greater development. The existing plant area is more than 10,000 square meters and there are more than 200 employees, including more than 60 R&D personnel (master, undergraduate or above More than 20 people), with an annual production capacity of more than 2,500 units, and annual sales of more than 200 million yuan. The company fully implements the ISO9001:2015 quality management system and provides hardware and software solutions known for innovation and reliability to meet the requirements of various demanding semiconductor and LED products in the industry, providing customers with high quality, high precision and high efficiency The semiconductor and LED packaging equipment allows us to provide customers with excellent solutions and improve product performance, so that customers will always have the most advanced equipment.
Founded
Patent
Technical experience
Researchers
300 units per month
Respect, integrity, dedication, innovation, and win-win
Consistent goals, quick action, and go all out
Become a semiconductor supplier enterprise benchmark for packaging equipment
Teamwork, brave to developKeep improving, create brilliant
April: High-precision ±5um, DB805A epoxy placement machine/DB805B eutectic machine
September: DB810 high-precision die bonding machine is launched, with an accuracy of ±10um, which is the highest-precision die bonding machine in China
December: Developed the DB85 semiconductor placement machine with double glue function
May: The DB8080WF automatic die changer double head die bonding machine with the most complete functions in history
November: DB8080 double-head high-speed die bonding machine was successfully developed
May: Obtained the "National Torch Plan Project Certificate" issued by the Ministry of Science and Technology
January: Obtained the title of "Shenzhen Famous Brand" and became the first LED packaging equipment manufacturer in Shenzhen to receive this honor
September: The company's intelligent high-speed automatic die-bonding machine was rated as "international advanced technology" by China Zhongke High-Tech Development Evaluation Center, becoming the first LED die-bonding machine product in China
March: Launched WB13V, China's first fully automatic high-speed wire bonding machine, and became the first domestic enterprise with an automatic high-speed wire bonding machine
February: Obtained the National High-tech Enterprise Certificate
September: Launched the world's first swing arm type automatic loading and unloading die bonding machine DB380L
August: Launched the first self-developed in-line LAMP die bonding machine, ending the 7-year unchanged state of imported similar equipment
December: The first multifunctional automatic die bonding machine was independently developed successfully, becoming the first domestic enterprise with a fully automatic die bonding machine
February: Advanced Optoelectronic Equipment (Shenzhen) Co., Ltd. was established
WeChat public account
Address:No.144-3, Hengping Road, Yuanshan Street, Longgang District, Shenzhen
Fax:+86-755-89705057
Tel:+86-755-28651309
WeChat public account
Address:No.144-3, Hengping Road, Yuanshan Street, Longgang District, Shenzhen
Fax:+86-755-89705057
Tel:+86-755-28651309