
DB886D double-head high-speed automatic die-bonding machine, automatic die-bonding for flat LED and COB products

DB6060 series double-head multi-function high-speed automatic wafer ring bonding machine, for flat LED, COB product automatic wafer ring bonding

DB298 is an ultra-high-speed automatic wafer ring bonding machine dedicated for in-line brackets

WeChat public account
Address:No.144-3, Hengping Road, Yuanshan Street, Longgang District, Shenzhen
Fax:+86-755-89705057
Tel:+86-755-28651309

WeChat public account
Address:No.144-3, Hengping Road, Yuanshan Street, Longgang District, Shenzhen
Fax:+86-755-89705057
Tel:+86-755-28651309
