国内首家固晶机

自主产权企业

CN EN

Brightlux

Create high-precision packaging equipment

Breakthrough industry standards, accuracy up to ±5 microns
Illumination

DB298 Straight Insert Bracket wafer ring Machine

Equipment overview:

Automatic wafer ring bonding machine for LED in-line bracket;

DB298 wafer visual identification, mechanical positioning of the bracket, high efficiency;

DB298V wafer/bracket dual visual recognition positioning, high solid wafer ring accuracy, fork receiving;

DB298VM wafer/bracket dual visual recognition positioning, high solid wafer ring precision, and material box receiving.

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Basic performance
  • Operating system: Windows XP

  • Operation interface: Chinese interface

  • Work cycle time: 170 msec

  • Positioning accuracy: ± 1.5mil

  • Angle accuracy: ± 3 °

  • Wafer size: 4 mil ×4 mil ~ 50 mil ×50 mil

  • Power supply: 220V±10V, 50Hz, 700W

  • Loading/unloading capacity: 200 pieces or 4k pieces (20 pieces)

  • Dispensing system: XY adjustable dispensing, constant temperature dispensing arm

  • Receiving system: counting dislocation function

  • Track bracket detection system: double brackets into the material detection; track with or without bracket detection

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