DB603 mini LED high-speed die-bonding machine, aiming at the automatic die-bonding of medium/small size backlight and full-color mini LED products, ca
DB601 large-size high-speed die-bonding machine, automatic die-bonding for medium/large-size backlight mini LEDs and large-capacity products
DB6060 series double-head multi-function high-speed automatic wafer ring bonding machine, for flat LED, COB product automatic wafer ring bonding
WeChat public account
Address:No.144-3, Hengping Road, Yuanshan Street, Longgang District, Shenzhen
Fax:+86-755-89705057
Tel:+86-755-28651309
WeChat public account
Address:No.144-3, Hengping Road, Yuanshan Street, Longgang District, Shenzhen
Fax:+86-755-89705057
Tel:+86-755-28651309