国内首家固晶机

自主产权企业

CN EN

Brightlux

Create high-precision packaging equipment

Breakthrough industry standards, accuracy up to ±5 microns
Communications industry

DB298 Straight Insert Bracket wafer ring Machine

Equipment Overview

DB85 semiconductor high-speed placement machine for automatic placement of flat semiconductor frames, ICs, flat LEDs and other products:

Automatic loading and unloading system reduces refueling time

Quality inspection function after solid wafer ring

Chip sorting function (MAP)

Chip reverse detection function before mounting

Automatic chip expansion function

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Basic performance
  • Operating system: WINDOWS XP

  • Operation interface: Chinese/English interface

  • Work cycle time: 200MSEC (fastest) UPH=18K

  • Positioning accuracy: ± 1.5MIL

  • Angle accuracy: ± 3 °

  • Chip size: 0.1MM ×0.1MM ~ 4MM ×4MM

  • Support bracket: flat semiconductor frame, IC, flat LED and other brackets

  • Power supply: 220V±10V, 50Hz, 800W

  • Chip stroke: 6” ~ 10” (selected according to wafer diameter)

  • Thimble system: single thimble system or multiple thimble system

  • Maximum bracket size: 80 MM × 200MM

  • Double glue dispensing system: XY adjustable glue dispensing, constant temperature rubber cylinder control

  • Automatic loading and unloading system: stacking clip loading and separate material box receiving

  • Working box width: 40MM~80MM adjustable

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