Operating system: WINDOWS XP
Operation interface: Chinese/English interface
Work cycle time: 200MSEC (fastest) UPH=18K
Positioning accuracy: ± 1.5MIL
Angle accuracy: ± 3 °
Chip size: 0.1MM ×0.1MM ~ 4MM ×4MM
Support bracket: flat semiconductor frame, IC, flat LED and other brackets
Power supply: 220V±10V, 50Hz, 800W
Chip stroke: 6” ~ 10” (selected according to wafer diameter)
Thimble system: single thimble system or multiple thimble system
Maximum bracket size: 80 MM × 200MM
Double glue dispensing system: XY adjustable glue dispensing, constant temperature rubber cylinder control
Automatic loading and unloading system: stacking clip loading and separate material box receiving
Working box width: 40MM~80MM adjustable