国内首家固晶机

自主产权企业

CN EN

Brightlux

Create high-precision packaging equipment

Breakthrough industry standards, accuracy up to ±5 microns
Optical communication

DB805B

Equipment Overview

High-precision welding (3 σ = ±5 μm)

Ability to handle tiny chips

Parameter sequence control can program the pressure

The pressure feedback method achieves high-precision pressure control

Check the location and accuracy of solder joints

6* 6 inch wafer ring (switchable GEL PACK)

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Basic performance
  • Applicable product types: VCSEL/LD (Laser Diode)/PD (Photo Diode)/Optical module/Analog device/LED/COC/COS etc.

  • SMD module: 2 sets of SMD modules, each module contains 4 nozzles, 3 6-inch Wafer ring feeding system, 1 relay table, SMD system, camera, etc.

  • Chip size: 250um*250um~5000um*5000um

  • PCB material length: 110mm~230mm

  • Production cycle time (1 chip, excluding eutectic time): 4sUPH=900pcs

  • Materials: Polyimide, Glass, PCB, FPC

  • Placement accuracy: ±5um @CPK >1.33

  • Angle error (in plane): ≤1°

  • Power supply: 110~220VAC/50Hz4500W

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