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Brightlux

Create high-precision packaging equipment

Breakthrough industry standards, accuracy up to ±5 microns
Optical communication
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DB810

Equipment Overview

DB810 high-precision automatic wafer ring bonding machine, for high-end LED, COB, optical communication products, automatic wafer ring bonding:

Twice solid wafer ring function

High-precision automatic calibration function

Automatic loading and unloading system reduces the waiting time for refueling

Quality inspection function after solid wafer ring

Wafer reverse detection function before die bonding

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Basic performance

  • Operating system: Windows 7

  • Operation interface: Chinese/English interface

  • Work cycle time: 700ms(Max) UPH=5K

  • Positioning accuracy: ±10um

  • Angle accuracy: ±0.5°

  • Wafer size: 4mil*4mil～100mil*100mil

  • Bracket specifications: length (L): 120-200mm width (W): 50-90mm

  • Wafer stroke: 6"

  • Power supply: 220V±10V, 50HZ600W

  • Power supply: 220V±10V, 50HZ600W

  • Dispensing system: XY adjustable dispensing, constant temperature dispensing arm

  • Working box width: 50mm-90mm adjustable

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Address:No.144-3, Hengping Road, Yuanshan Street, Longgang District, Shenzhen

Fax:+86-755-89705057

Tel:+86-755-28651309

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All rights reserved   Advanced Optoelectronic Equipment(Shenzhen)Co.LTD   Technical Support: CTM Sitemap

WeChat public account

Address:No.144-3, Hengping Road, Yuanshan Street, Longgang District, Shenzhen

Fax:+86-755-89705057

Tel:+86-755-28651309

All rights reserved   Advanced Optoelectronic Equipment(Shenzhen)Co.LTD    

Technical Support: CTMSitemap

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