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Create high-precision packaging equipment

Breakthrough industry standards, accuracy up to ±5 microns
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DB810S

Equipment Overview

DB810S high-precision automatic wafer ring bonding machine, for high-end LED, COB, optical communication products, automatic wafer ring bonding:

Twice linear solid wafer ring function

High-precision automatic calibration function

Quality inspection function after solid wafer ring

Wafer reverse detection function before die bonding

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Basic performance

  • Operating system: Windows 7

  • Operation interface: Chinese/English interface

  • Heating of solid wafer ring table: normal temperature ~ 400℃ (optional)

  • Positioning accuracy: ±5~10um

  • Angle accuracy: ±1°

  • Wafer size: 3mil*5mil～20mil*20mil

  • Bracket specifications: Length (L): 120-200mm width (W): 50-90mm

  • Wafer stroke: 6"

  • Power supply: 220V±10V, 50HZ600W

  • Dispensing system: XY adjustable dispensing, constant temperature dispensing arm

  • Working box width: 50mm-90mm adjustable

  • Work cycle time:
    UPH=200pcs (±5um accuracy)
    UPH=1.6K (±10um accuracy)

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Address:No.144-3, Hengping Road, Yuanshan Street, Longgang District, Shenzhen

Fax:+86-755-89705057

Tel:+86-755-28651309

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Address:No.144-3, Hengping Road, Yuanshan Street, Longgang District, Shenzhen

Fax:+86-755-89705057

Tel:+86-755-28651309

All rights reserved   Advanced Optoelectronic Equipment(Shenzhen)Co.LTD    

Technical Support: CTMSitemap

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