国内首家固晶机

自主产权企业

CN EN

Brightlux

Create high-precision packaging equipment

Breakthrough industry standards, accuracy up to ±5 microns
Camera module

DB396T

Equipment Overview

Db396t high speed automatic loading and unloading solid wafer ring machine, for the industry plane LED products automatic solid wafer ring:

Automatic loading and unloading function

Quality inspection function after solid wafer ring

Wafer sorting function

Wafer ring automatic correction function

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Basic performance
  • Operating system: Windows XP

  • Operation interface: Chinese interface

  • Cycle time: 130 msec (fastest, depending on product requirements)

  • Positioning accuracy: ± 1mil

  • Angle accuracy: ± 3 °

  • Wafer size: 4 mil × 4 mil ~ 100 Mil × 100 Mil

  • Support bracket: planar LED bracket, SMD, cob, high power

  • Power supply: 220 V ± 10 V, 50 Hz, 0.9 kW

  • Wafer ring size: 6

  • Maximum solid wafer ring support size: 75mm × 160mm

  • Dispensing system: XY adjustable dispensing, constant temperature dispensing arm

  • Working box width: 30mm ~ 75mm, adjustable

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