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Brightlux

Create high-precision packaging equipment

Breakthrough industry standards, accuracy up to ±5 microns
Camera module
3c industry
Communications industry
Automobile industry
Automation equipment
3c industry Communications industry Automobile industry Automation equipment

HomeCamera module

Illumination Display Backlight Camera module
Optical communication RF device RF components
Illumination Display Lidar

DB810

Equipment Overview

DB810 high-precision automatic wafer ring bonding machine, for high-end LED, COB, optical communication products, automatic wafer ring bonding:

Twice solid wafer ring function

High-precision automatic calibration function

Automatic loading and unloading system reduces the waiting time for refueling

Quality inspection function after solid wafer ring

Wafer reverse detection function before die bonding

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Basic performance

  • Operating system: Windows 7

  • Operation interface: Chinese/English interface

  • Work cycle time: 700ms(Max) UPH=5K

  • Positioning accuracy: ±10um

  • Angle accuracy: ±0.5°

  • Wafer size: 4mil*4mil～100mil*100mil

  • Bracket specifications: length (L): 120-200mm width (W): 50-90mm

  • Wafer stroke: 6"

  • Power supply: 220V±10V, 50HZ600W

  • Power supply: 220V±10V, 50HZ600W

  • Dispensing system: XY adjustable dispensing, constant temperature dispensing arm

  • Working box width: 50mm-90mm adjustable

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Address:No.144-3, Hengping Road, Yuanshan Street, Longgang District, Shenzhen

Fax:+86-755-89705057

Tel:+86-755-28651309

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All rights reserved   Advanced Optoelectronic Equipment(Shenzhen)Co.LTD   Technical Support: CTM Sitemap

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Address:No.144-3, Hengping Road, Yuanshan Street, Longgang District, Shenzhen

Fax:+86-755-89705057

Tel:+86-755-28651309

All rights reserved   Advanced Optoelectronic Equipment(Shenzhen)Co.LTD    

Technical Support: CTMSitemap

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