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Create high-precision packaging equipment

Breakthrough industry standards, accuracy up to ±5 microns
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DB601

Equipment Overview

DB601 large-size high-speed die-bonding machine, automatic die-bonding for medium/large-size backlight mini LEDs and large-capacity products

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Basic performance

  • Operating system: Windows 7

  • Operation interface: Chinese/English interface

  • Working cycle time: ≤100ms (0.7mm pitch)

  • Positioning accuracy: ±15um @CPK >1.33

  • Angle accuracy: ± 3 °

  • Wafer size: 3mil*3.5mil~20mil*20mil

  • Power supply: 220V±10V, 50Hz, 800W

  • Wafer ring size: 8 inch

  • Product length: ≤620mm

  • Product width: ≤355mm

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Address:No.144-3, Hengping Road, Yuanshan Street, Longgang District, Shenzhen

Fax:+86-755-89705057

Tel:+86-755-28651309

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All rights reserved   Advanced Optoelectronic Equipment(Shenzhen)Co.LTD   Technical Support: CTM Sitemap

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Address:No.144-3, Hengping Road, Yuanshan Street, Longgang District, Shenzhen

Fax:+86-755-89705057

Tel:+86-755-28651309

All rights reserved   Advanced Optoelectronic Equipment(Shenzhen)Co.LTD    

Technical Support: CTMSitemap

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