DB888—Advanced Optoelectronic Equipment(Shenzhen)Co.LTD

DB888

Equipment Overview

DB888 automatic wafer ring bonding machine, three-connected machine has three welding heads and nine wafer rings, and each welding head can be operated independently, each single machine has three wafer rings (can hold three RGB chips at the same time), has excellent production performance, this This machine can be widely used in the production of RGB polycrystalline and solder paste materials, which can greatly improve the production yield and production efficiency, and meet the mass production of Mini LED.

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Basic performance

Operating system: Windows 7
Work cycle time: single head 140msuph: 24K three-piece conjoined 70 ms
XY positioning accuracy: ±1mil
Wafer deflection angle: ± 3 °
Use chip size: 4mil*4mil～100mil*100mil
Bracket: flat LED light, SMD (0603, 1010), TOP SMD (3014, 2835), Chip, RGB, etc.
Quality inspection function after solid wafer ring : glue quantity detection, wafer distance deviation detection, solid wafer ring angle error detection
Production material specification range: width 50-90mm adjustable \ length 100-270 mm
Dispensing system: precise and simple XY direction fine adjustment, constant temperature dispensing arm
Automatic loading and unloading system: separate material box loading and unloading
Wafer ring size: ø6″
Maximum bracket size: 80 MM × 200MM

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国内首家固晶机

自主产权企业

Brightlux

Create high-precision packaging equipment

Breakthrough industry standards, accuracy up to ±5 microns

DB888

Operating system: Windows 7

Work cycle time: single head 140msuph: 24K three-piece conjoined 70 ms

XY positioning accuracy: ±1mil

Wafer deflection angle: ± 3 °

Use chip size: 4mil4mil～100mil100mil

Bracket: flat LED light, SMD (0603, 1010), TOP SMD (3014, 2835), Chip, RGB, etc.

Quality inspection function after solid wafer ring : glue quantity detection, wafer distance deviation detection, solid wafer ring angle error detection

Production material specification range: width 50-90mm adjustable \ length 100-270 mm

Dispensing system: precise and simple XY direction fine adjustment, constant temperature dispensing arm

Automatic loading and unloading system: separate material box loading and unloading

Wafer ring size: ø6″

Maximum bracket size: 80 MM × 200MM

Contact Information

Contact Information

国内首家固晶机

自主产权企业

Into Brightlux

Advanced Optoelectronics-a well-known domestic supplier of semiconductor and LED packaging equipment

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Advanced Optoelectronics-a well-known domestic supplier of semiconductor and LED packaging equipment

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Advanced Optoelectronics-a well-known domestic supplier of semiconductor and LED packaging equipment

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Advanced Optoelectronics-a well-known domestic supplier of semiconductor and LED packaging equipment

Contact us

Advanced Optoelectronics-a well-known domestic supplier of semiconductor and LED packaging equipment

Brightlux

Create high-precision packaging equipment

Breakthrough industry standards, accuracy up to ±5 microns

DB888

Operating system: Windows 7

Work cycle time: single head 140msuph: 24K three-piece conjoined 70 ms

XY positioning accuracy: ±1mil

Wafer deflection angle: ± 3 °

Use chip size: 4mil*4mil～100mil*100mil

Bracket: flat LED light, SMD (0603, 1010), TOP SMD (3014, 2835), Chip, RGB, etc.

Quality inspection function after solid wafer ring : glue quantity detection, wafer distance deviation detection, solid wafer ring angle error detection

Production material specification range: width 50-90mm adjustable \ length 100-270 mm

Dispensing system: precise and simple XY direction fine adjustment, constant temperature dispensing arm

Automatic loading and unloading system: separate material box loading and unloading

Wafer ring size: ø6″

Maximum bracket size: 80 MM × 200MM

Contact Information

Contact Information

Use chip size: 4mil4mil～100mil100mil