T30-WSS passive placement machine

DB805B

DB805A

DB396T

Db396t high speed automatic loading and unloading solid wafer ring machine, for the industry plane LED products automatic solid wafer ring

DB601

DB601 large-size high-speed die-bonding machine, automatic die-bonding for medium/large-size backlight mini LEDs and large-capacity products

DB6060

DB6060 series double-head multi-function high-speed automatic wafer ring bonding machine, for flat LED, COB product automatic wafer ring bonding

DB601

DB601 large-size high-speed die-bonding machine, automatic die-bonding for medium/large-size backlight mini LEDs and large-capacity products

DB888

DB888 automatic wafer ring bonding machine, three-connected machine has three welding heads and nine wafer ring, and each welding head can be operated

DB886D

DB886D double-head high-speed automatic die-bonding machine, automatic die-bonding for flat LED and COB products